How Hot Embossing Works
Hot embossing is a sophisticated manufacturing technique that mechanically displaces thermoplastic polymers by pressing a structured mold into a heated polymer substrate. As the polymer softens under heat, the microscale features of the mold are imprinted into the surface, creating intricate channels and structures vital for microfluidic applications.
Technical Advantages
Hot embossing excels in manufacturing micro components, offering a cost-effective and timely solution. This technique outperforms alternatives like micromilling by producing smaller, smoother microstructures in polymer substrates, ideal for medium-volume production.
High reproducibility with tight tolerances, allowing for consistent quality in mass production.
Excellent Reproducibility
Hot embossing is compatible with a wide range of thermoplastic materials, including COP/COC, PMMA, PC, and more, providing versatility and flexibility in material selection.
Material Compatibility
Hot embossing achieves micrometer to sub-micrometer precision, enabling the creation of highly detailed microfluidic channels and structures.
High Precision & Feature Size
Key Benefits of Hot Embossing
Considerations for Choosing Hot Embossing for Microfluidic Chip Production
Suitable for 10 to 10,000 units, making it ideal for both prototype development and small to medium-scale production.
Production Volume
Ranges from 1 minute to 1 hour, depending on the complexity and size of the components.
Cycle Time
Medium investment for prototypes and small batches, with costs increasing for series production, balanced by the method’s efficiency and quality.
Product Cost
Reference Cases
Contact us to discuss your microfluidic project requirements and objectives.
Consultation
Partner Match
We connect you with the hot embossing experts from our network.
We oversee the entire project, ensuring smooth coordination and timely delivery.
Project Management
Coloured area indicates the method's ideal chip production volume.
10
1000
10 000
100 000
100 000 000 +