Welding uses localized application of energy to bond materials, with ultrasonic utilizing high-frequency vibrations and laser using focused light.

Best suited for robust, industrial-scale applications requiring precise, hermetic sealing.

Key Features:

• Precision Bonding: Both methods allow precise control over the bonding area, minimizing impact on surrounding areas.

• Rapid Process: Especially ultrasonic welding, which can complete bonds in seconds.

Utilizes low-pressure plasma to activate the substrate surface, enhancing its adhesion potential, followed by thermal fusion bonding.

Key Features:

• Surface Activation: Plasma creates a highly reactive surface for improved bonding strength.

• Eco-Friendly Process: No use of chemical additives, minimizing contamination risks.

Involves treating the substrate with a solvent to slightly dissolve the surface, preparing it for bonding under light heat and pressure.

Key Features:

• Low-Temperature Process: Typically around 40°C, suitable for heat-sensitive applications.

• Minimal Residual Solvent: Designed to evaporate during bonding, leaving minimal residues.

This method directly bonds polymer substrates by applying heat and pressure until the material softens and fuses together.

Key Features:

• No Additional Materials: Ensures a clean bonding process with only the substrate material involved.

• Controlled Heat Application: Critical to avoid deformation of microstructures within the substrate.

Adhesive bonding uses a substance added between substrates to connect them, such as tape or glue, offering flexibility in application.

Key Features:

• Variety of Tapes and Glues: Can choose from biofriendly variants to enhance biocompatibility.

• Tailored Thickness: Adhesive layers can be customized in thickness for different bonding strength needs.

• UV Curable Adhesives: Offers controlled curing via UV light, avoiding the need for high temperatures.