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Read Out
Device
Quality
Control
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Assay development
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Biochemical assay development based on aptamers, antibodies, nucleic acids, enzymes and others
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Transfer of existing lab-based protocols (ELISA, LAMP, PCR, etc.) into a microfluidic system
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Molecular diagnostics assay development for infectious and inherited diseases
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Assay optimization/customization for microfluidic chip integration
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Materials
Imprinting materials with customizable properties
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Surface energy adjustment (hydrophobic – hydrophilic)
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Viscosity, elasticity, refractive indexScratch resistance
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Recyclability & compostability
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Biomaterials (printable bioinks, thin coatings, scaffolds, hydrogels)
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Stimuli-sensitive hydrogels
Substrates
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(Biodegradable) thermoplastics
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COC substrates of any color
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Glass
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Nanoparticle doped membranes
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Toolmaking
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Photolithography (deep structure 1D, two Layer, 2.5D, DUV, DRIE)
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Micromilling 2.5D masters
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Ni or polymer imprinting tools (up to sqm)
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Shim & sleeve welding
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Design & Simulation
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Microfluidic design library accelerates time to samples
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Multiphysics simulation (flow, diffusion, species, particles,..)
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Simulation of fluid dynamics (CFD) to optimise design
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Optical simulations to increase S/N
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Layout for photomasks & imprinting tools
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Replication
Large Scale Production
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R2R UV Nano imprint lithography (UV resins)
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R2R extrusion coating (thermoplastics)
Design Rules
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Channel width/ depth: mm/200μm
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Aspect ratio: 1:1
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Total thickness: 50 μm – 250 μm
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Exceeding dimensions to be discussed
Medium Scale
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Injection molding
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Hot embossing
Prototyping
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Micromilling
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Surface Functionalization
Bio Functionalization
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R2R micro spotting
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Covalent immobilization on foil substrates (sciPOLY3D)
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Physisorption, chemisorption, bioconjugation techniques
Chemical Fuctionalization
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Plasma & Corona treatment
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Sterilization
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Chemical functionalization of polymer substrates (COC, COP, PS, PLA and others)
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Orientated immobilization of biomolecules on surfaces
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Electrodes & Sensors
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Integration of screen printed electrodes on flexible substrates
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Integration of sensing elements on a chip
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Backend Processes
Bonding
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UV bonding
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Solvent bonding
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Ultrasonic bonding
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Glue bonding Assembly
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Foils to rigid parts (e.g. foil to microtiter plates)
Medium Scale
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Injection molding
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Hot embossing Prototyping
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Micromilling
Singulation
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Chip cutting with high-energy pulse laser Inlet Cutting
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Packaging
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Ultrashort pulse laser
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Aluminium pouches under cleanroom conditions